This product is provided by the company ÜÇSA AMBALAJ SAN. VE TİC. A.Ş.
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Product Description
In terms of packaging structure, we offer packaging solutions for biscuit, wafer, and cake product groups using single, two, or multi-layer structure combinations — either with the desired material compositions or with high-barrier properties when required.High barrierLow oxygen and water vapor permeabilityLight protectionLow COF (Coefficient of Friction) valueCold seal application for heat-sensitive productsHigh lamination strengthLow heat seal initiation temperatureMatte varnish applicationPaper touch application