Chips and Snack Packaging

As for packaging structure, we offer packaging solutions for chips and snack product groups using two or multi-layer structure combinations, either with the desired material specifications or with high-barrier properties when required. High barrier Low oxygen and water vapor permeability Low heat seal initiation temperature Light protection High aroma barrier High lamination strength Leak-proof capability Low COF (Coefficient of Friction) value Matte varnish application Paper touch application