This product is provided by the company ÜÇSA AMBALAJ SAN. VE TİC. A.Ş.
. Please contact for more information.
Product Description
As for packaging structure, we offer packaging solutions for chips and snack product groups using two or multi-layer structure combinations, either with the desired material specifications or with high-barrier properties when required.
High barrier
Low oxygen and water vapor permeability
Low heat seal initiation temperature
Light protection
High aroma barrier
High lamination strength
Leak-proof capability
Low COF (Coefficient of Friction) value
Matte varnish application
Paper touch application