Biscuit Packaging and Cake Packaging

In terms of packaging structure, we offer packaging solutions for biscuit, wafer, and cake product groups using single, two, or multi-layer structure combinations — either with the desired material compositions or with high-barrier properties when required. High barrier Low oxygen and water vapor permeability Light protection Low COF (Coefficient of Friction) value Cold seal application for heat-sensitive products High lamination strength Low heat seal initiation temperature Matte varnish application Paper touch application